Olivia Zheng

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on the atlas — 38

highlights — 90

reduces the oscillation range from 27.63 N to 4.92 N (82.2 % reduction).
A novel sEMG-based force interaction strategy of supernumerary robotic limbs | Journal of Mechanical Science and Technology | Springer Nature Link
fuzzy PID-based force control method
A novel sEMG-based force interaction strategy of supernumerary robotic limbs | Journal of Mechanical Science and Technology | Springer Nature Link
RMSE, MAPE, and R2 of the model are 1.16, 4 %, and 0.995, respectively,
A novel sEMG-based force interaction strategy of supernumerary robotic limbs | Journal of Mechanical Science and Technology | Springer Nature Link
SRLs require an efficient force interaction strategy that can dynamically adjust the output force of robotic limbs according to the wearer’s intention
A novel sEMG-based force interaction strategy of supernumerary robotic limbs | Journal of Mechanical Science and Technology | Springer Nature Link
60 EEG electrodes were selected by following a 10-20 international configuration
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
60 Hz with a notch filter
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
α oscillations in the occipital channels (e.g., O1, O2, and Oz)
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
Consequently, we collected data from 3,300 trials (1,800 trials for arm-reaching, 900 for hand-grasping, and 600 for wrist-twisting)
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
When the experiment began, visual instructions were provided on the monitor by displaying a black cross sign on a gray background. The participants stared at the visual instructions for 4 s while resting. After resting, a visual cue was displayed on the monitor with a text sign for 3 s, following which the participants began preparing to perform the real-movement or MI tasks according to the visual cue (see Fig. 2). Upon changing the visual cue to a text sign reading “Movement Execution” and “Movement Imagery,” the participants performed the corresponding tasks during 4 s. During the real-move…
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
maintain impedance values <15 kω
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
3,300 trials were collected per participant
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
which were mainly used for artifact removal
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
11 different movement tasks: arm-reaching along 6 directions, hand-grasping of 3 objects, and wrist-twisting with 2 different motions
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
25 healthy participants
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
60-channel electroencephalography
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
11 different upper extremity movement tasks
Multimodal signal dataset for 11 intuitive movement tasks from single upper extremity during multiple recording sessions | GigaScience | Oxford Academic
stimulation capabilities
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
high-quality recordings of both local field potentials and single-neuron action potentials
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
setting it apart from traditional flexible electrodes
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
sort out six neurons
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
measured the impedance
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
poly(3,4-ethylene dioxythiophene) (PEDOT) electroplating
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
standards of the neuroscience community for action potential recording
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
extra nickel/gold layers
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
robust ohmic contact
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
Fig. 2: Evaluation of locomotor behavior in mice using open-field tests.
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
double-sided polyimide tape
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
final probe is completely freestanding and flexible without any silicon substrate
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
probes are released from the wafer using a Buffered Oxide Etch (BOE) solution
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
biocompatibility of polyimide
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
multistep fabrication sequence includes metal deposition, polyimide solidification, gold evaporation, and another polyimide layer, followed by reactive ion etching (RIE) device etching to expose the recording sites, bonding pads, and vias. These sites are further coated with a platinum-iridium alloy to optimize signal acquisition
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
Supplementary Fig. 2
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
Supplementary Fig. 1
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
two primary sections: the back end, which connects to the external electrical system, and the front end, which is implanted into brain tissue.
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
QFN packaged Intan chip (model number RHS2116)
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
quad flat no-leads package (QFN) and ball grid array (BGA) chips
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
Comparative visualization of the size and weight between the SP and the FLID, highlighting the significant reduction achieved with the FLID design
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
Fabricated flexible probe
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
Fig. 1: Design and fabrication of the FLID.
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
direct connection between the flexible probe and the chip
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
physical constraints
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
spike amplitude of ~200 μV with an average signal-to-noise ratio (SNR) of 12.7 postsort
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
Immunohistochemical analysis
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
without requiring extra electroplating
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
platinum-iridium (Pt-Ir) alloy
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
pairs a homemade flexible probe with a commercial Intan amplifier chip (Intan Technologies) directly onto a printed circuit board (PCB)
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
the innovative through-polymer via (TPV) method, which involves crafting a flexible, lightweight, integrated device (FLID) that overcomes the need for traditional adapters
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
vertical multichip module, known as three-dimensional integrated circuits (3D ICs)
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
exacerbates connection challenges due to their inherent flexibility
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering
percutaneous connectors,
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes | Microsystems & Nanoengineering