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Integrated circuit packaging - Wikipedia

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Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the integrated circuit. The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. Therefore, it is important that the materials used as electrical contacts exhibit characteristics like low resistance, low capacitance and low inductance.[1] Both the structure and materials must prioritize signal transmission properties, while minimizing any parasitic elements that could negatively affect the signal. Controlling the

Integrated circuit packaging - Wikipedia Jump to content From Wikipedia, the free encyclopedia Final stage of semiconductor device fabrication This article is about the final stage in the manufacturing process of integrated circuits. For an article about the physical enclosure that surrounds integrated circuits, see Semiconductor package . This article is currently slated for merging . There is consensus to merge Semiconductor package into this article. You can carry out the merge by following the resolution at the AfD discussion and the merging instructions . (June 2026) Do not remove this no

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