AI Value Chain Champions & Bottlenecks - by Tech Fund
techinvestments.io · 510 words · saved by 1 readers
Key Findings This Week
ASML’s tone has shifted from estimates where demand will be in the coming years to how much capacity they can provide (source: JP Morgan conference). Due to manufacturing optimizations, the company can probably ship 110 EUV tools in the coming years without building new clean rooms. We can see that EUV shipments showed lackluster growth as from 2021. This was driven by two key factors—the industry digested the capacity which had been added during the covid semi boom while TSMC also moved to the 2nm node, which didn’t see an increase in litho intensity. Because TSMC didn’t dramatically…
saved by
related reading
- China’s CXMT Is Set to Challenge DRAM Incumbentsnewsletter.semianalysis.com
- Dylan Patel — Deep dive on the 3 big bottlenecks to scaling AI computedwarkesh.com
- How to Build a $20 Billion Semiconductor Fabconstruction-physics.com
- The Tradition of Knowledge Behind ASMLbrief.bismarckanalysis.com
- ASML | The world's supplier to the semiconductor industryasml.com
- Jon Y (Asianometry) on Problems And Progress in Semiconductor Manufacturing - Hear This Ideahearthisidea.com
- The Great AI Silicon Shortagenewsletter.semianalysis.com
- ASML’s boss has a warning for Europeeconomist.com
- Deep Dive: Building an American TSMC | Contrary Researchresearch.contrary.com
- Growth surge masks structural strain in semiconductor marketevertiq.com
- Chips and China – Stratechery by Ben Thompsonstratechery.com
- The Economics of TSMC’s Giga-Fabs - by Jon Yasianometry.com