THERM-A-GAP PAD - Chomerics Division | Parker US
Thermal gap pads are a type of thermal interface material (TIM) specifically designed to fill gaps between heat-generating electronics components and heat-dissipating surfaces. Pads are manufactured in sheets or continuous rolls at various thicknesses and are often cut to an application-specific size or shape. They are also available in a range of thermal conductivity values with higher conductivity associated with greater heat dissipation. Parker Chomerics THERM-A-GAP™ PAD 80LOE is a high performance, low oil bleed, thermal gap filler pad with a typical thermal conductivity of 8.0 W/m-K. PAD 80LOE was developed to be a high reliability and long-term solution for mission critical and high-performance electronics in nearly every market segment including advanced computing, defense electronics, telecommunications infrastructure, and automotive modules. “LO” in the product name stands for “Low Oil”, indicating the very low silicone oil bleed and migration properties of this gap pad. PAD