CoWoS® - Taiwan Semiconductor Manufacturing Company Limited
TSMC’s world-leading CoWoS® advanced 2.5D packaging technology provides the essential foundation for high-performance computing (HPC) and artificial intelligence (AI) products. By integrating multiple SoCs and high-bandwidth memory stacks, CoWoS® empowers products with high-performance compute and memory bandwidth. CoWoS®-S can accommodate an interposer up to 3.3X-reticle size (or ~2700mm2). CoWoS®-L or CoWoS®-R are recommended for larger than 3.3X-reticle interposer sizes. A variety of interconnect options provide integration flexibility to meet performance target. Since entering volume production in 2012, the CoWoS® platform has continued to evolve, offering a growing number of options. With the advent of generative AI in late 2022, market demand for CoWoS® solutions has become even greater. To support next-generation products such as HPC, AI, and mobile applications, TSMC continues to expand its advanced packaging capacity, helping customers accelerate innovation to meet rapidly cha